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Product - MU736

MU736

MU736

HUAWEI Sierra wireless communication 3G module MU736 HSPA+ M.2 Module

 

Introduction:

HUAWEI MU736 is a HSPA+ module with NGFF interface, supporting Penta-band (B1/B2/B4/B5/B8) for worldwide network coverage, low power consumption, GPS, and global carrier certifications, enabling easier and more flexible design and integration into end devices. HUAWEI MU736 is world|#@@#|s first M.2 Module for ultrabook, tablet and notebook application. In addition, the HUAWEI MU736 supports all NGFF features to optimize performance, power consumption, and usability.

Key Feature:

DL 21Mbps/UL 5.76Mbps

* Intel Shark Bay FFRD

* Low power consumption

* GPS Standalone, A-GPS

* M.2 Package

* Ultrabook feature support

* OS: Windows/ Window 8 / Android 4.0

 

Specification:

Form Factor:

M.2

* Penta-band UMTS/HSPA/HSPA+

2100/1900/AWS/900/850MHz

* 2G Quad-Band GSM/GPRS/EDGE

850/900/1800/1900MHz

* Size:

42 mm X 30 mm X 2.3 mm

* Weight:

< 6g

SIM Card supply voltage:

1.8v ~3.0v UICC(SIM/UICC/USIM)

>>Supply Voltage range:

3.3v~4.2v(3.7v is recommended)

>>Temperature Range:

Normal Operation:-10°C to +55 °C

Extended Operation:             

 -20°C to +70 °C      


Storage:

 -40°C to +85 °C

 

 

 

General features

 

 

1. Penta-band WCDMA/HSPA/HSPA+2100/1900/900/850/AWS MHz

 

     Quad-band GSM/GPRS/EDGE 1900/1800/900/850MHz

 

2. GPRS/EDGE: Multi-slot Class 12,Class B

 

3. Max transmitter power

 

     WCDMA/HSPA/HSPA+2100/1900/900/850/AWS MHz: +24 dBm (Power Class 3)

 

     GSM/GPRS 900/850MHz :+33dBm(Power Class 4)

 

      GSM/GPRS 1900/1800 MHz:+30dBm (Power Class 1)

 

     EDGE 850/900MHz:+27dBm (Power Class E2)

 

     EDGE 1800/1900MHz:+26dBm (Power Class E2)

 

 

 

4. Control Via AT Commands

 

     3GPP TS 27.007 and TS 27.005

 

    Huawei extended AT command

 

5. SIM Card supply voltage: 1.8v ~3.0v UICC(SIM/UICC/USIM)

 

6. Supply Voltage range:3.3v~4.2v(3.7v is recommended)

 

7. Temperature Range: Normal Operation:-10°C to +55 °C

 

  Module showing:  

  



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